Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging
Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging
T. Chiu,En-Yu Yeh
2018 · DOI: 10.1016/j.microrel.2017.11.008
Microelectronics and reliability · 50 Citations
TLDR
Evaluations based on the comprehensive chemical-thermomechanical model considering the full process history can be approximated by the estimations from a simplified viscoelastic warpage model considering only the thermal excursion.