Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process
Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process
Shang-Shiuan Deng,Sheng-Jye Hwang,Huei-Huang Lee
2013 · DOI: 10.1109/TCPMT.2012.2228005
IEEE Transactions on Components, Packaging, and Manufacturing Technology · 63 Citations