Warpage Modeling and Characterization of the Viscoelastic Relaxation for Cured Molding Process in Fan-Out Packages
Warpage Modeling and Characterization of the Viscoelastic Relaxation for Cured Molding Process in Fan-Out Packages
S. Yeh,P. Lin,6 Authors,S. Jeng
2017 · DOI: 10.1109/ECTC.2017.158
Electronic Components and Technology Conference · 18 Citations