UCle-Compliant Chiplet Interconnect Design Leveraging Cutting-Edge Packaging Technologies

UCle is a new chiplet interconnect standard offering superior bandwidth density and interoperability. This paper provides a comprehensive exploration of UCle interconnect design, focusing on four essential aspects: interface circuit architecture, floorplan strategies, package-level channel optimization, and power delivery network (PDN) analysis. The insights presented offer a systematic approach to design UCle-compliant interfaces, considering various packaging options and link speeds to achieve the best-fit design.