Thermocompression Bonding Process Design and Optimization for Warpage Mitigation of Ultra-Thin Low-CTE Package Assemblies
Thermocompression Bonding Process Design and Optimization for Warpage Mitigation of Ultra-Thin Low-CTE Package Assemblies
Vidya Jayaram,S. McCann,4 Authors,R. Tummala
2016 · DOI: 10.1109/ECTC.2016.384
Electronic Components and Technology Conference · 14 Citations