Signaling scheme for high speed die-to-die interconnection in multi-chip package (MCP) technology
Signaling scheme for high speed die-to-die interconnection in multi-chip package (MCP) technology
K. Yong,B. E. Cheah,W. Song,M. F. Ain
2013 · DOI: 10.1109/EPTC.2013.6745707
Electronic Packaging Technology Conference · 0 Citations