Signaling analysis of inter-chip I/O package routing for Multi-Chip Package
Signaling analysis of inter-chip I/O package routing for Multi-Chip Package
K. Yong,W. Song,B. E. Cheah,M. F. Ain
2012 · DOI: 10.1109/ACQED.2012.6320509
Asia Symposium on Quality Electronic Design · 10 Citations