Signal Integrity Analysis and Validation of GHz I/O Interface on Wire Bond Ball Grid Array Technology Package
Signal Integrity Analysis and Validation of GHz I/O Interface on Wire Bond Ball Grid Array Technology Package
H. Since,L. C. Kim,Kuan Chin Lee
2006 · DOI: 10.1109/EMAP.2006.4430589
International Conference on Electronic Materials and Packaging · 4 Citations