Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for high bandwidth memory (HBM)
Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for high bandwidth memory (HBM)
Kyungjun Cho,Youngwoo Kim,5 Authors,Joungho Kim
2017 · DOI: 10.1109/EDAPS.2017.8277051
Electrical Design of Advanced Packaging and Systems Symposium · 10 Citations