Phase growth in alpha brass with thin layer of electroplated zinc during homogenization annealing

Diffusion mechanism in between thin electroplated Zn coating and Cu – 37wt%Zn substrate during homogenization annealing substantially depends on electroplating parameters. Experiments carried out to determine phase growth and solute profile at various current densities reveal that the increase of current density tends to reduce phase growth. The coefficient of phase growth has been determined and is found to be dependent on the relative density of plating layer.