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Multi-Layer High Speed Transmission Connector

Jun-Wen Yiu,Wei-Tes Kao,Cheng-Ting Liu,Sheng-Yao Hu

2024 · DOI: 10.1109/iWEM59914.2024.10649251
IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition · 0 Citations

Abstract

This study aims to compare the differences in connector applications between ribbon cables and micro strip lines, as well as to analyze their impact on the performance of communication systems. Ribbon cables and micro strip lines, as common PCB transmission lines in modern communication systems, exhibit significant disparities in connector usage. Through literature review and experimental research, this study analyzes the design requirements, performance indicators, and applicability differences of connectors on these two kinds of transmission media. Particularly in high-frequency and high-speed data transmission, ribbon cables and micro strip lines impose different demands on connectors, and the challenges that may be encountered in practical applications are discussed. Furthermore, this study proposes optimization recommendations for connector designs tailored to ribbon cable and micro strip line scenarios, aiming to enhance the overall performance and reliability of communication systems. Additionally, this study emphasizes the application of simulating the circuit characteristics of BGA-packaged ICs in multi-layer board conditions to complement the understanding of connector designs across different transmission media.