Modeling and Simulation of Electrical Interconnects, Packages and Devices for Highspeed Applications

With increasing demands for high signal speeds and circuit density, non-ideal behavior of interconnects and components have become more and more important for the performance and EMC compliance of modern electronic devices and systems. This tutorial presents an overview of state-of-the-art techniques for electrical interconnect and packaging modeling, for their reduced-order equivalent circuit extraction, and for behavioral characterization of digital devices. Applications cover a wide spectrum of implementation hierarchy, from chip level to printed circuit boards.