Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology
Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology
F. Che,D. Ho,M. Ding,Xiaowu Zhang
2015 · DOI: 10.1109/EPTC.2015.7412319
Electronic Packaging Technology Conference · 79 Citations