Mitigation of Signal Integrity Issues in High-Speed Signals within System-in-Package Using Tabbed Routing Structure

With the continuous advancement of microelectronics technology towards higher frequencies and speeds, System-in-Package (SiP) has become one of the core packaging technologies for many product applications. As chip clock frequencies continue to rise, the entire system becomes more sensitive to signal integrity issues. How to mitigate signal integrity problems in high-speed interconnects within packages has become a critical challenge. To investigate far-end crosstalk (FEXT) and impedance discontinuity issues in high-frequency signals within packages, we implemented tabbed routing structures to optimize transmission links. The study examined the effects of Ltab, Stab, Wtab, and the number of tabs on FEXT and impedance characteristics. Using single-factor analysis and orthogonal experimental design combined with range analysis, we conducted simulation studies to evaluate each factor's influence, ultimately obtaining two optimal parameter combinations that meet design requirements. The results revealed that Wtab and the number of tabs have more significant impacts on both FEXT and impedance. Eye diagram analysis provided visual comparison of the two optimized combinations, demonstrating that the configuration with impedance closest to 50 ohms achieved maximum improvement-increasing eye height from 0.445V to 0.452V and eye width from 79.58ps to 81.25ps. Furthermore, when FEXT parameters already met requirements, additional optimization of impedance parameters to enhance continuity yielded better performance improvements for high-speed signal transmission.