Interposer design optimization for high frequency signal transmission in passive and active interposer using through silicon via (TSV)
Interposer design optimization for high frequency signal transmission in passive and active interposer using through silicon via (TSV)
Namhoon Kim,Daniel Wu,2 Authors,Paul Wu
2011 · DOI: 10.1109/ECTC.2011.5898657
Electronic Components and Technology Conference · 120 Citations