Integration benefits and challenges on Fan-Out to enable system in package for IoT/Wearable Devices
Integration benefits and challenges on Fan-Out to enable system in package for IoT/Wearable Devices
H. Tang,Max Lu,4 Authors,Yu-Po Wang
2017 · DOI: 10.1109/EPTC.2017.8277425
Electronic Packaging Technology Conference · 7 Citations