Improvements of System-in-Package Integration and Electrical Performance Using BVA Wire Bonding
Improvements of System-in-Package Integration and Electrical Performance Using BVA Wire Bonding
Shaowu Huang,J. DeLaCruz
2017 · DOI: 10.1109/TCPMT.2017.2657380
IEEE Transactions on Components, Packaging, and Manufacturing Technology · 17 Citations