Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
Fengze Hou,Tingyu Lin,4 Authors,G. Zhang
2017 · DOI: 10.1109/TCPMT.2017.2726084
IEEE Transactions on Components, Packaging, and Manufacturing Technology · 61 Citations