Experimental and simulative study of warpage behavior for fan-out wafer-level packaging
Experimental and simulative study of warpage behavior for fan-out wafer-level packaging
M. van Dijk,S. Huber,3 Authors,M. Schneider-Ramelow
2022 · DOI: 10.1016/j.microrel.2022.114585
Microelectronics and reliability · 15 Citations