Design space exploration of Through Silicon Vias for high-speed, low loss vertical links
Design space exploration of Through Silicon Vias for high-speed, low loss vertical links
Somesh Kumar,Sarabjeet Kaur,3 Authors,Rohit Sharma
2014 · DOI: 10.1109/EDAPS.2014.7030802
Electrical Design of Advanced Packaging and Systems Symposium · 6 Citations