Co-DTC: Concentric Trench-Based Integrated Capacitors for Advanced Chiplet-Based Platforms

Integrated power delivery methodology is a promising approach to achieve high power efficiency as the semiconductor industry targets higher power density and increased heterogeneity across different load characteristics. High quality and densely integrated passive devices are key components for the realization of integrated power delivery approaches. Co-DTC, a novel integrated deep trench-based capacitor, is proposed in this paper. The proposed capacitive structure, process flow, theoretical models, and simulation of key performance parameters, are presented. Results confirm that Co-DTC exhibits 99.42%, 49.31%, and 21.70% improvements in terms of, respectively, capacitance density, parasitic resistance, and parasitic inductance. The Co-DTC also exhibits excellent performance in terms of leakage current and breakdown voltage, as compared to state-of-the-art integrated capacitor technologies. A case study on a wafer-scale chiplet-based platform demonstrates that using Co-DTCs instead of conventional DTCs as the last stage decoupling capacitor lead to a two orders-of-magnitude increase in the frequency range of operation.