Analysis and Measurement of Power Integrity and Jitter Impacts on Thin-Core and Coreless Packages
Analysis and Measurement of Power Integrity and Jitter Impacts on Thin-Core and Coreless Packages
Y. Hahm,Ming Li,4 Authors,Simon Wang
2016 · DOI: 10.1109/ECTC.2016.323
Electronic Components and Technology Conference · 4 Citations