Wet-Etched Three-Level Silicon Interposer for 3-D Embedding and Connecting of Optoelectronic Dies and CMOS ICs
Wet-Etched Three-Level Silicon Interposer for 3-D Embedding and Connecting of Optoelectronic Dies and CMOS ICs
Chenhui Li,R. Stabile,3 Authors,O. Raz
2018 · DOI: 10.1109/TCPMT.2017.2786550
IEEE Transactions on Components, Packaging, and Manufacturing Technology · 6 Citations