Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process
Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process
Meiying Su,Liqiang Cao,4 Authors,Gengxin Tian
2018 · DOI: 10.1016/j.microrel.2018.02.010
Microelectronics and reliability · 31 Citations
TLDR
A simple and efficient FEA (Finite Element Analysis) method based on shell element was introduced for feasibility of large panel fan-out packaging technology in aspect of material, package geometries, package size, process conditions and metal density.