Study of thinned Si wafer warpage in 3D stacked wafers
Study of thinned Si wafer warpage in 3D stacked wafers
Youngrae Kim,Sungbum Kang,S. Kim
2010 · DOI: 10.1016/j.microrel.2010.05.006
Microelectronics and reliability · 31 Citations
TLDR
In this study, the wafer warpage of thinned Si wafers in stacked wafer has been evaluated and wafer curvature and how it relates to bonding material, substrate material of the stacked layers, and thickness of thinning Si wafer will be discussed.