Package Technology Enabling for 224 Gbps Electrical Signaling

224 Gbps is the next fundamental per-lane serializer/deserializer (SerDes) electrical signaling speed target for Ethernet for data centers. Package high-speed signaling performance is a key area of interest to enable competitive channel/platform solutions at this speed. This paper provides a comprehensive review of the package technologies developed for both routing and ball grid array (BGA) second level interconnect (SLI), including the corresponding modeling and validation data. With the proposed technology building blocks, we demonstrate that it is feasible to achieve -6.5 dB overall package loss at 56 GHz and 90˚ C for a typical switch type data center product.