Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions
Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions
S. Yoon,P. Tang,3 Authors,R. Pendse
2013 · DOI: 10.1109/ECTC.2013.6575830
54 Citations