Erratum: 3D-printed microelectronics for integrated circuitry and passive wireless sensors
Erratum: 3D-printed microelectronics for integrated circuitry and passive wireless sensors
Sung-Yueh Wu,Chen Yang,W. Hsu,Liwei Lin
TLDR
This work establishes an innovative approach to construct arbitrary 3D systems with embedded electrical structures as integrated circuitry for various applications, including the demonstrated passive wireless sensors.
Abstract
Erratum to: Microsystems & Nanoengineering (2015) 1, 15013; doi: 10.1038/micronano.2015.13; Published online: 20 July 2015 Since the publication of this article, the authors would like to make two corrections in the third(last) paragraph of “Design and Fabrication” section as follows: Replace “fused deposition modeling technology” with “multi-jet modeling (MJM)”; The company information of “ProJet HD 3000 printer, Hewlett-Packard Company, Palo Alto, CA, USA” should be replaced with “ProJet HD 3000 printer, 3D Systems Inc.