Electrical characterization of RF TSV for 3D multi-core and heterogeneous ICs
Electrical characterization of RF TSV for 3D multi-core and heterogeneous ICs
Le Yu,Haigang Yang,3 Authors,Wei Wang
2010 · DOI: 10.1109/ICCAD.2010.5654244
29 Citations
Electrical characterization of RF TSV for 3D multi-core and heterogeneous ICs
Le Yu,Haigang Yang,3 Authors,Wei Wang