Electrical Modeling and Design of Coaxial Through-Silicon Via Compatible with Deep Trench Capacitor Process for 3D RF System Integration
Electrical Modeling and Design of Coaxial Through-Silicon Via Compatible with Deep Trench Capacitor Process for 3D RF System Integration
Peimian Cai,Zhiquan Liu,3 Authors,Wugang Liao
2025 · DOI: 10.1109/iWRFAT65352.2025.11102916
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