Effective die-package-PCB co-design methodology and its deployment in 10 Gbps serial link transceiver FPGA packages
Effective die-package-PCB co-design methodology and its deployment in 10 Gbps serial link transceiver FPGA packages
Xiaohong Jiang,Hong Shi
2009 · DOI: 10.1109/MWSYM.2009.5165816
IEEE MTT-S International Microwave Symposium Digest · 11 Citations