Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps
Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps
K. Oi,Satoshi Otake,7 Authors,Z. Kutlu
2014 · DOI: 10.1109/ECTC.2014.6897310
Electronic Components and Technology Conference · 120 Citations