Design and Reliability Assessment of Novel 3D-IC Packaging
Design and Reliability Assessment of Novel 3D-IC Packaging
Yen-Fu Su,K. Chiang,S. Liang
2017 · DOI: 10.1017/JMECH.2016.82
22 Citations
Design and Reliability Assessment of Novel 3D-IC Packaging
Yen-Fu Su,K. Chiang,S. Liang