A novel trench routing for next-generation high-speed serial buses beyond 10Gbps applications
A novel trench routing for next-generation high-speed serial buses beyond 10Gbps applications
J. Kong,B. E. Cheah,2 Authors,L. Lo
2016 · DOI: 10.1109/EPTC.2016.7861534
Electronic Packaging Technology Conference · 3 Citations